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Product

BU-510

 
Solder ball implant machine　BU-510

Detailed specifications

  • External size: 75cm (L), X 25cm (W), X 26cm (H)

  • Weight: 28.7 kg.

  • Voltage: 110/220V 50/60Hz.

  • the use of air pressure: 6 kg / cm ².

  • solder ball Specifications: in accordance with the use of BGA solder balls of different specifications may vary.

  • BGA mold: BGA according to different specifications may change demand SIZE die BGA.

  • BGA mold: BGA according to different specifications may change demand SIZE Mold solder ball.

  • solder ball implantation Speed: solder ball BGA-PAD implants can be fine-tuning speed control of solder ball implant. 

  • solder ball implantation rate: 98%. 

  • solder ball implant precision: 0.03 mm. 

  • die groove back material: the speed of retreat is expected 30 - 300 mm / S. 

  • automatically printing sik time ball: 22/sec  

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