Wei Ta Cheng Industrial Co., Ltd

BGA rework equipment - Solder ball placement system BU-600

Outside dimension: 83.8cm(L), 25cm(W), 33.6cm(H)
Weight: 36.5 kg.
Working voltage: 220V 50/60Hz
Working air pressure: 6 kg/cm².
Solder ball specification: According to the solder ball spec being used by different kinds of BGA package.
BGA IC holder: It is available for changing-over different types of BGA IC holders according to different size or spec of BGA package.
Solder ball screening fixture: It is available for changing-over different ball screening fixtures according to different size or spec of solder ball.
Solder ball placing speed: The speed for placing solder balls onto BGA pads can be adjusted and fine-tuning controlled.
Ball-placing yield rate: 98%.
Ball-placing accuracy: 0.03mm.
BGA IC holder unloading speed: Unloading speed 30~300 mm/s.
Automatic ball-placing operation cycle time : 30 seconds.

Outside dimension: 83.8cm(L), 25cm(W), 33.6cm(H)