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Home/ Product/ Tin ball machine series/ Solder ball implant machine　BU-560s

Product

BU-560s

 
Solder ball implant machine　BU-560s

Detailed specifications

  • External size: 90㎝(L)×46㎝(W)×53㎝(H

  • Weight: 32kg.

  • Voltage: AC-220V50/60HZ.

  • Use SIZE: BGA maximum effective use range Dimensions 40㎜×60㎜.

  • solder ball Specifications: in accordance with the use of BGA solder balls of different specifications may vary.

  • BGA mold: BGA according to different specifications may change demand SIZE die BGA.

  • BGA mold: BGA according to different specifications may change demand SIZE Mold solder ball.

  • solder ball implantation Speed: solder ball BGA-PAD implants can be fine-tuning speed control of solder ball implant. 

  • solder ball implantation rate: 98%. 

  • solder ball implant precision: 0.05 mm. 

  • Complete the die change of solder ball mold and BGA mold within 10sec. 

  • A small variety of BU-560s models for quick die change.  

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