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Elsie Ball Machine series
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Product Name：Solder ball implant machine BU-510

Solder ball implant machine BU-510

Download:

BU-510

Detailed specifications

  1. External size :75cm(L),X 25cm(W),X 26cm(H)
  2. Weight: 28.7 kg.
  3. Voltage: 110/220V 50/60Hz.
  4. the use of air pressure: 6 kg/cm².
  5. solder ball Specifications: in accordance with the use of BGA solder balls of different specifications may vary.
  6. BGA mold: BGA according to different specifications may change demand SIZE die BGA.
  7. solder ball implantation Speed: solder ball BGA-PAD implants can be fine-tuning speed control of solder ball implant.
  8. solder ball implantation rate: 98%.
  9. solder ball implant precision: 0.03 mm.
  10. die groove back material: the speed of retreat is expected 30 - 300 mm / S.
  11. automatic ball time: 22/sec

Product Name：Solder ball implant machine BU-550E

Solder ball implant machine BU-550E

Detailed specifications

  1. External size :75cm(L),X 25cm(W),X 26cm(H)
  2. Weight: 28.7 kg.
  3. Voltage: 110/220V 50/60Hz.
  4. the use of air pressure: 6 kg/cm².
  5. solder ball Specifications: in accordance with the use of BGA solder balls of different specifications may vary.
  6. BGA mold: BGA according to different specifications may change demand SIZE die BGA.
  7. solder ball implantation Speed: solder ball BGA-PAD implants can be fine-tuning speed control of solder ball implant.
  8. solder ball implantation rate: 100%.
  9. solder ball implant precision: 0.03 mm.
  10. die groove back material: the speed of retreat is expected 30 - 300 mm / S.
  11. automatic ball time: 22/sec

Product Name：Solder ball implant machine BU-560

Solder ball implant machine BU-560

Download:

BU-560

Detailed specifications

  1. External size :75cm(L),X 25cm(W),X 26cm(H)
  2. Weight: 30.5 kg.
  3. Voltage: 110/220V 50/60Hz.
  4. the use of air pressure: 6 kg/cm².
  5. solder ball Specifications: in accordance with the use of BGA solder balls of different specifications may vary.
  6. BGA mold: BGA according to different specifications may change demand SIZE die BGA.
  7. solder ball implantation Speed: solder ball BGA-PAD implants can be fine-tuning speed control of solder ball implant.
  8. solder ball implantation rate: 98%.
  9. solder ball implant precision: 0.03 mm.
  10. die groove back material: the speed of retreat is expected 30 - 300 mm / S.
  11. automatic ball time: 22/sec

Product Name：Solder ball implant machine BU-560L

Solder ball implant machine BU-560

Detailed specifications

Product Name：Solder ball implant machine BU-560s

Solder ball implant machine BU-560

Detailed specifications

  1. External size: 90㎝(L)×46㎝(W)×53㎝(H)
  2. Weight: 32 kg.
  3. Voltage: AC-220V50/60HZ.
  4. Use SIZE: BGA maximum effective use range Dimensions 40㎜×60㎜.
  5. solder ball Specifications: in accordance with the use of BGA solder balls of different specifications may vary.
    6. 40㎜×60㎜.
  6. BGA mold: BGA according to different specifications may change demand SIZE Mold solder ball.
  7. BGA mold: BGA according to different specifications may change demand SIZE die BGA.
  8. solder ball implantation Speed: solder ball BGA-PAD implants can be fine-tuning speed control of solder ball implant.
  9. solder ball implant precision: 0.05 mm.
  10. Complete the die change of solder ball mold and BGA mold within 10sec.
  11. A small variety of BU-560s models for quick die change.

Product Name：Solder ball implant machine BU-565

Solder ball implant machine BU-565

Download:

BU-565

Detailed specifications

  1. External size :75cm(L),X 25cm(W),X 26cm(H)
  2. Weight: 30.5 kg.
  3. Voltage: 110/220V 50/60Hz.
  4. the use of air pressure: 6 kg/cm².
  5. solder ball Specifications: in accordance with the use of BGA solder balls of different specifications may vary.
  6. BGA mold: BGA according to different specifications may change demand SIZE die BGA.
  7. solder ball implantation Speed: solder ball BGA-PAD implants can be fine-tuning speed control of solder ball implant.
  8. solder ball implantation rate: 98%.
  9. solder ball implant precision: 0.03 mm.
  10. die groove back material: the speed of retreat is expected 30 - 300 mm / S.
  11. automatic ball time: 22/sec

Product Name：Printing Solder ball implant machine BU-570

移印Solder ball implant machine BU-570

Detailed specifications

  1. External size :84cm(L),X 36cm(W),X 59cm(H)
  2. Weight: 42 kg.
  3. Voltage: 110/220V 50/60Hz.
  4. the use of air pressure: 6 kg/cm².
  5. solder ball Specifications: in accordance with the use of BGA solder balls of different specifications may vary.
  6. BGA mold: BGA according to different specifications may change demand SIZE die BGA.
  7. solder ball implantation Speed: solder ball BGA-PAD implants can be fine-tuning speed control of solder ball implant.
  8. solder ball implantation rate: 100%.
  9. solder ball implant precision: 0.03 mm.
  10. die groove back material: the speed of retreat is expected 30 - 300 mm / S.
  11. automatic ball time: 42/sec

Product Name： Solder ball implant machine BU-600

Solder ball implant machine BU-600

Detailed specifications

Product Name：Pb-free reflow furnace ball TU-380

Pb-free reflow furnace ball TU-380

Detailed specifications

  1. External size :85cm-(L),28cm-(W),28cm(H)
  2. Voltage: AC220V/50/60HZ
  3. Power: 3200W
  4. Weight: 40Kg
  5. reflow scope: 155mmX155mm
  6. N2-conditioning: N2 required to provide external, flow rate can be fine-tuned nitrogen tolerance, back to welding to reduce the oxidation process for unleaded and leaded Process, adjusting the scope of 0 ~ 25 M3/min (1 LPM = 28 1/min).
  7. ammeter: shows the current use of current, start heating current 15A, Tatsu set temperature, temperature compensation at about 6.2A ~ 8A.
  8. hours on this machine under the heating zone and heating zone, equipped with two sets of temperature controller can be configured to control, respectively independent with different heating temperature.
  9. and normal by the start the heat engine to reach set temperature at a cost of about 25 minutes.
  10. Thermostat function:
    1. advanced 2-DOF PID temperature control, together with FUZZY-order functions manually adjusted.
    2. Microcomputer PID temperature control, micro-computer automatically adjusts the heating time and the curve width can be self-heating temperature.
    3. intelligent temperature control, monitoring changes in the working environment, self-RUN self-tune PID values, stability requirements set temperature, Temperature regulation +0.5% FS +1 igit.
    4. Temperature setting range: 28 ℃ ~ 420 ℃
    5. Temperature Display Accuracy: 0.1 ℃.
  11. timer function - can demand back into the welding zone set time, set the range of 0.1~ 999se set accuracy 0.1sec, the time. By the operator to change settings at any time free time
  12. AUT0-automatic key, pallet conveyor automatic BGAIC to reflow zones, track the implementation of set the time line back to welding, completed disk Orlando Automatically exit, return to the starting area, the cooling fan to complete the reflow process.
  13. shutdown on the eve of the closure to be welded to their back button to return to welding temperature to be cooled down to below 100 ℃ in order to close the electric POWER Source button, and after the closure of the total power valve.
  14. take home tray operation, do not the weight tray, causing the sliding axis bending deformation, resulting in the road when the tray is not smooth.

Product Name：Automatic de-soldering air-knife TU-680W

Automatic de-soldering air-knife TU-680W

Download:

TU-680W

Product patents：

China Patent Taiwan Patent

Detailed specifications

  1. Weight: 71 kg
  2. External size: 57cm(L)× 67cm(W)×60cm(H)
  3. Voltage: AV110V/50/60HZ
  4. Maximum working current: 25 A
  5. the use of air pressure: : 6 kg/c㎡
  6. Working package range: 27mm×27mm ~ 45mm×45mm
  7. Effective cleaning length: 48mm
  8. Cleaning cycle time: According to total of all setting parameters.
  9. Cleaning part: BGA IC parts.
  10. 360°illumination lamp: 6 Watt
  11. Air-knife flow meter(28 liter/min): Tuning range :0 ~ 100 M3/min (1 LPM =28 l/min)

Product Name：全自动除锡风刀TU-680X

全自动除锡风刀TU-680X

Download:

TU-680X

Product patents：

China Patent Taiwan Patent

Detailed specifications

  1. Weight: 55 kg
  2. External size: 57cm(L)× 67cm(W)×60cm(H)
  3. Voltage: AV110V/50/60HZ
  4. Maximum working current: 18 A
  5. the use of air pressure: : 6 kg/c㎡
  6. Working package range: 27mm×27mm ~ 40mm×40mm
  7. Effective cleaning length: 40mm
  8. Cleaning cycle time: According to total of all setting parameters.
  9. Cleaning part: BGA IC parts.
  10. 360°illumination lamp: 6 Watt
  11. Air-knife flow meter(28 liter/min): Tuning range :0 ~ 100 M3/min (1 LPM =28 l/min)

Product Name：BGA VT-360

BGA 返修台VT-360

Detailed specifications

  1. 3 parts of heat up system by independent temperature control.
  2. World originate RGBW image system
  3. Automatic create rework temperature profile by seven points in line.
  4. Flexible placed table for PCB
  5. Automatic disassembly and place BGA
  6. Multiple safety and protection function
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